Phenolic resin for special materials

Phenolic resin for phenolic fiberglass


Phenolic resin for special materials：

Phenolic resin for special materials improves the molding processability and product porosity of phenolic resin, and the shrinkage rate during curing is almost zero; its performance in tensile modulus, tensile strength, elongation at break, etc. are better than phenolic resin and epoxy resin: its dielectric constant changes very little with wavelength, the concentration toxicity and corrosiveness of combustion smoke are much lower, and it also has low water absorption.

Phenolic resin products for special materials are as follows:

modelAppearanceSolid content@135℃Viscosity 625℃Moisture (%)Thermal plate gel @210℃(S)Application and features
TC-8300Light yellow to brownish red liquid75±2200-400≤1.0280-500Various electronic insulating materials, copper clad laminates, etc., light color
TC-840069.0-71.0150-300≤1.0600-900Various electronic insulating materials, copper clad laminates, etc., excellent bonding performance and heat resistance

Packaging: Liquid products are packaged in 240Kg iron drums or 1000kg ton barrels, solid resins are packaged in 20Kg valve bags or 25Kg kraft paper bags lined with plastic bags.

Storage: In a dry, ventilated and cool place (below 20℃), avoid direct sunlight and stay away from heat sources. The general storage period is 6 months in winter and 3 months in summer (below 20℃)